インストロン主催の新しいインストロン・コミュニティ・ブログへようこそ。 インストロンならではの最高にフレッシュかつ頭脳明晰で才能豊かな人々の集まりです。 材料科学の世界は果てしなく広く、膨大な業界や材料、課題が対象となっています。そのため、その道の専門家、あるいは材料科学の達人になるために必要なあらゆる知識を1人で備えるのは到底無理です。 コミュニティ・ブログには、専門的ノウハウや体験、アイデアを連携して出し合い、最も正確で関連のある情報をタイミング良く読者に提供してくれる豊富な人材が集まっています。
自己紹介、意見、そして自身の体験についてお話しください。 インストロン・コミュニティでお待ちしています。
In early 2018, the United States Congress passed the first major tax reform since 1986, reducing the corporate tax rate from 35% to 21%. Find out why this is good news for businesses looking to purchase capital equipment this year.
Watch this new video to see how the versatile TestMaster AT3 Automated Testing System makes it easy to run tensile tests on thin films, improving repeatability, safety, and efficiency.
Have you ever wondered how strong those straps are that hold down loads on tractor-trailers?
Learn about the multiple ways to use an Instron® system for medical device testing in this interview with Dr. Matthieu De Beule, Biomedical Research Professor at Ghent University.
While maintaining all of the power and flexibility found in previous versions of Bluehill Software, our newest static testing software, Bluehill Universal was built from the ground up for touch interaction and boasts many advanced capabilities. With anything new, people have questions. Here are the top 5 we get, that you might also wonder!
Posted By Elena Mangano OnJan 16, 2018 10:57 AM
As a standard feature with the new Bluehill® Universal Software, QuickTest allows operators to start testing after merely entering basic parameters in a few seconds.
As anyone with a smartphone is aware, software developers are constantly improving their software with periodic updates for a variety of reasons. Major phone companies release updates at least once a year, and in between the major updates, they push out smaller bug fixes and patches as flaws are inevitably found in the program, application, or operating system. This same idea applies with Bluehill® Software.
Posted By Ian Kirk OnMay 24, 2017 10:32 AM
The progressive outcome of Bluehill® Universal took a consolidated effort from Instron experts, bringing together unrivaled experience and cutting-edge research. The user experience has been designed by a collaboration of members from different software teams across the world, each team representing various software products offered by Instron. This consortium has worked closely together to create a Bluehill application style that can be translated across all of Instron’s software products.
Reliability analysis of electronic packages and components is a critical step in microelectronics, as these packages are widely used in portable devices such as smartphones, tablets, laptops, etc. Studying electrical performance may not be enough, as a package’s mechanical characterization can directly or indirectly impact reliability of a finished product. Three-point bend tests are performed to understand the strength of chip packages, such as chip-on-film (COF), integrated circuits (IC), and ball grid arrays (BGAs).
Posted By Rajiv Iyer OnApr 03, 2017 03:33 PM
