Torsion Testing of Flexible Circuits and Microelectronic Components
Because the industry has trended towards the miniaturization of mobile electronic devices, flexible printed circuits (FPC) have become increasingly attractive to OEMs. In addition, the availability of flexible electronic displays allows these products to be flexible or bendable. As these technologies are still relatively new, it is critical to understand the mechanical reliability of these sub-assemblies. Understanding how torsion is applied to FPC panels is important when evaluating component layout patterns under various load conditions.